Job Description

At Teledyne Technologies, you help power the technologies that move industries forward — from aerospace and defense to medical research and environmental monitoring. As part of our high‑reliability semiconductor operations, you ensure the quality and performance of devices used in some of the world’s most demanding applications. Your work directly supports our long‑term mission: delivering precision, reliability, and innovation to customers who depend on it.

What you’ll do

• Perform detailed external visual inspections using microscopes to identify physical defects or inconsistencies
• Verify device dimensions, markings, solder joints, lead bends, and overall package quality
• Measure device dimensions and lead geometry using calipers and other precision measurement tools
• Conduct external visual and pre‑shipment inspections to meet internal and customer standards
• Operate solder dipping equipment in accordance with established procedures and quality requirements
• Perform solderability testing using solderability test machines to verify lead finish integrity and compliance
• Operate X‑ray fluorescence (XRF) equipment to verify material composition and plating thickness
• Utilize Odyssey and other test and inspection equipment to support quality and reliability evaluations
• Operate environmental test equipment, including temperature, humidity, and thermal shock chambers
• Load, unload, and monitor devices during testing while maintaining accurate documentation
• Complete basic electrical checks before and after environmental tests
• Prepare test hardware, load devices into handlers, and support production test operations
• Maintain inspection records and update device status in computer systems
• Collaborate with production and quality teams to resolve discrepancies
• Follow cleanroom and electrostatic discharge (ESD) safety protocols

What you need

• Strong attention to detail and steady hand skills for microscope‑based inspection — required
• Ability to read and follow technical instructions, procedures, and production documentation — required
• Basic computer proficiency and communication skills — required
• Ability to multitask and remain effective in fast‑paced situations — required
• Hands‑on experience operating solder dipping machines — required
• Experience performing solderability testing using solderability test equipment — required
• Experience handling semiconductor devices or electronic components — preferred
• Experience using calipers and precision measurement tools — strongly preferred
• Experience operating XRF, Odyssey, and other semiconductor test or inspection equipment — strongly preferred
• 5+ years’ related semiconductor manufacturing, testing, or inspection experience — required
• High school diploma or equivalent — required
• Ability to lift or move 5–10 lbs routinely — required

What we offer

You’ll join a team known for precision, innovation, and reliability. Teledyne employees benefit from a stable, growing company with opportunities to expand skills, contribute to high‑impact products, and work in a supportive, team‑oriented environment.

What happens next

After submitting your application, our hiring team will review your background and contact you regarding next steps.

Employment with Teledyne may require the ability to meet export control or other regulatory compliance requirements.