Job Description

Description

Description

Hybrid Remote position. 50% travel required for this role. 

Job Responsibilities

You will be working with a variety of semiconductor fabrication wet processes including, but not limited to: FEOL clean, BEOL clean, wet etch, wet strip and photolithography coat and develop. Responsibilities include: demonstrating new and routine processes to prospective customers, writing demo and technical reports, consulting with our customers in process related issues, and participating in and supporting new hardware development projects as they relate to process development.

Position is hybrid/remote. Both Domestic and International travel to Shellback Applications Lab in Coopersburg, PA and customer sites is required to transfer processes (Tier 2), provide process trouble shooting, qualification, and minor hardware adjustments if necessary.

Requirements

Requirements

Skills/Qualifications:

*Must have experience in a Wafer Fab Manufacturing environment, specifically in Wets Area (Wet Etch, Clean, Surface Prep, and Resist Strip or Photolithography).*

- Minimum of 2 years of wet process experience in the semiconductor industry as a process engineer.
- Hands on experience with wet process equipment including minor hardware troubleshooting and maintenance.
- Experience with Batch Spray Tools is desired, but not required.
- Understanding of experimental design and data analysis.
- Good written communication and interpersonal skills.
- Proof of U.S. citizenship or legal entry to the U.S. for employment in the U.S.

Education

BS or BAS degree in chemistry, chemical engineering, material science, or physics from an accredited university or an AAS degree with at least 5 years of semiconductor experience.