Location: Alhambra, CA (Onsite)

Job Summary:

Reporting to the VP Quality Engineering & Technology, this person will be responsible for managing quality operations within the InP fabrication facility supporting laser and gain chip production for high-speed optical AI infrastructure applications. This position requires thorough understanding of III-V semiconductor processes, photonic device physics, and quality management practices in high-volume wafer manufacturing environments. Support and establish procedures for new product introduction, technology development, process optimization and failure analysis investigations.

Responsibilities:

Serve as Management Representative for ISO systems, coordinating cross-functional teams to maintain documentation, implement corrective actions, and drive continuous improvement initiatives aligned with ISO9001:2015 Quality Management System and ISO14001:2015 Environmental Management System certifications. (20%)
Manage day-to-day quality operations across InP wafer fabrication including epitaxy (MOCVD/MBE) and wafer processing. Interface between fab operations and Engineering teams to drive yield improvement and quality enhancement initiatives. (20%)
Lead inline and final inspection strategies for laser and gain chip products including LIV (Light-Current-Voltage), spectral performance, and optical power characterization. (10%)
Actively participate in new process development for advanced photonic devices including DFB/DBR lasers, semiconductor optical amplifiers (SOAs), and photonic integrated circuits (PICs). (10%)
Manage Quality Continuous Improvement activities through data analysis, SPC monitoring, root cause identification and implementation of corrective and preventative actions across the Product Development Cycle. (10%)
Participate and drive DFM, DFT, and FMEA activities within the engineering groups specific to photonic devices. (10%)
Lead reliability qualification activities including HTOL, burn-in screening, and life-testing for laser devices meeting datacenter AI infrastructure requirements. (10%)
Manage supplier quality for critical materials including InP substrates, precursor gases, and outsourced processes. (10%)

Minimum Qualifications:

Master's Degree in Electrical/Electronic Engineering, Applied Physics, Materials Science, Optical Engineering or related degree. PhD is a plus.
Solid knowledge of III-V semiconductor device physics with emphasis on InP-based photonic devices including edge-emitting lasers, VCSELs, SOAs, and modulators.
Deep understanding of InP epitaxial growth processes (MOCVD/MBE), including material quality assessment, layer structure optimization, and defect management.
Solid knowledge of wafer fabrication processes specific to III-V compounds including dry/wet etching, metallization, passivation, cleaving, and AR/HR coating technologies.
7+ years of demonstrated experience in quality engineering, product engineering, or process engineering within III-V semiconductor or photonics manufacturing environment.
Demonstrated experience implementing and maintaining ISO9001 and ISO14001 management systems in a manufacturing environment.
Experience with high-speed optical transceivers, datacenter interconnects, or coherent optical communication systems is highly desirable.
Effective communicator with the ability to interface at all levels within the organization, possessing a thorough written and verbal command of the English language.

Desired Qualifications

Advanced degree in applicable Engineering/Science field. Experience in III-V semiconductor fabrication, photonic device manufacturing and optical testing
Proven ability to solve complex technical problems and analyze data using statistical concepts and tools (JMP, Minitab, Python/R)
Exposure to Lean Manufacturing and Six Sigma methodologies, ideally Green/Black Belt certified
ISO9001 and/or ISO14001 Lead Auditor certification is highly desirable
Familiarity with reliability standards for optical components (Telcordia GR-468, IEC standards)
Understanding of AI infrastructure requirements and optical interconnect architectures (400G/800G/1.6T)
Travel Required: 10 to 20% (primarily to customer sites, substrate suppliers, or outsource partners)

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.

A reasonable estimate of the pay range for this position is $130,000 - $185,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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