Date Posted:

2026-02-20

Country:

United States of America

Location:

US-MA-REMOTE

Position Role Type:

Remote

U.S. Citizen, U.S. Person, or Immigration Status Requirements:

The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Security Clearance Type:

DoD Clearance: Secret

Security Clearance Status:

Active and existing security clearance required after day 1

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

Job Summary:

The RF Microelectronics/Module Design & Foundry Services Department at Raytheon in Andover, MA, is currently seeking a Principal Electro-Mechanical Engineer to develop leading-edge miniaturized 3DHI sensors and systems to enable future generation technologies across Raytheon.

The successful candidate will be a highly motivated “self-starter” who will apply strong mechanical and electrical engineering skills to implement innovative solutions to challenging design criteria. They will be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products. This position requires strong interpersonal, written, and verbal communication skills to maintain positive relationships & satisfaction with program leadership (Engineering and Program Management). Knowledge of semiconductor manufacturing processes and materials and prior experience working with contract manufacturers (OSATs) is highly desired.

The role requires knowledge of high-density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping and general knowledge in areas of electronic components/devices such as ASICs and FPGAs, design of electronic packaging chassis and structures, interconnects (connectors/cables), and thermal management design of high-density electronic systems and electronic enclosures. The successful candidate will have the ability to bring new and fresh ideas to the team, with opportunities to explore research and innovation areas in a collaborative and fun team environment. Additionally, the candidate is expected to follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met.

What You Will Do:

Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products
Leverage industry-leading manufacturing and novel materials to achieve new levels of electro-mechanical performance and reliability

Qualifications You Must Have:

Typically requires a Bachelor’s Degree in a Science, Technology, Engineering & Math (STEM) Field and a minimum of Eight (8) or more years of relevant experience (An advanced STEM degree could count for 3 years of experience) with mechanical and electrical engineering design.
Experience performing circuit layout design using 2D CAD tools
Experience with mechanical and electrical engineering design
The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance

Qualifications We Prefer:

A Master’s degree or PhD. in a Science, Technology, Engineering & Math (STEM) Field
Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/Thermal/Digital co-design
Experience qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging
Experience in RF circuit design, including 3D EM simulation in HFSS or similar tools
Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+)
Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing)
Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products
Experience with designing electronics for extreme environmental requirements and design constraints
Proficiency with 3D Mechanical CAD modeling and analysis tools (e.g., Solidworks, Creo).
Innovative attitude to apply towards research and development of new technologies
Excellent interpersonal and multi-tasking skills
Excellent written and verbal communication skills
Ability to work independently and in a team environment, including as a leader of small teams
Experience in Geometric Dimensioning and Tolerance analysis for drawings
Current DoD Secret level security clearance

What We Offer:

Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.

As part of our commitment to maintaining a secure hiring process, candidates may be asked to attend select steps of the interview process in-person at one of our office locations, regardless of whether the role is designated as on-site, hybrid or remote.

The salary range for this role is 107,500 USD - 204,500 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate’s work experience, location, education/training, and key skills.

Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.

Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement. Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company’s performance.

This role is a U.S.-based role. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply.

RTX anticipates the application window closing approximately 40 days from the date the notice was posted. However, factors such as candidate flow and business necessity may require RTX to shorten or extend the application window.

RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability or veteran status, or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act.

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