Job Description

Job Description

Please note this position supports our Weekend Night Shift working Friday, Saturday and Sunday from 3:00PM to 3:00AM. You will work 36 Hours and be paid for 40 Hours plus earn a 15% pay premium.

See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems.
Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safe.

The selected individual will fabricate and/or modify complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine.  Must be familiar with substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach.  Must be familiar with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings). Must be familiar with working with a wide variety of adhesives and epoxy's.  Must be familiar with operating an MRSI 505 and 605. Must be able to work with a microscope for an entire shift. Can fabricate and/or modify complex microwave/RF integrated circuit modules and sub-assemblies. Must be familiar with MIL-STD-883 and working with bonding complex microwave modules.
 
 
 

About BAE Systems Electronic Systems

BAE Systems, Inc. is a defense, aerospace, and security company headquartered in Falls Church, Virginia, with more than 40,000 employees worldwide. We serve, supply, and protect those who protect us. As one of the most geographically diverse international defense companies, we deliver a full range of products and services spanning air, land, maritime, space, and cyber, including advanced electronics, intelligence solutions, and dedicated customer support.

Our culture is performance-driven and values-led, built on curiosity, creativity, and collaboration. Purpose isn't a tagline here. It's what drives us. We're developing breakthrough technologies that defend national security and make a lasting impact on our communities and our planet. When you join BAE Systems, you're not just building a career. You're contributing to a mission that truly matters.

This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.

Required Skills and Education

High School Diploma or GED. 1 year of work experience or equivalent experience required in lieu of a High School Diploma or GED.

The selected individual will fabricate and/or modify complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine.  Must be familiar with substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach.  Must be familiar with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings). Must be familiar with working with a wide variety of adhesives and epoxy's.  Must be familiar with operating an MRSI 505 and 605. Must be able to work with a microscope for an entire shift. Can fabricate and/or modify complex microwave/RF integrated circuit modules and sub-assemblies. Must be familiar with MIL-STD-883 and working with bonding complex microwave modules.

Preferred Skills and Education

Solumina/Paperless experience 
TIPQA experience 
Secret Clearance 
Wire and ribbon bonding experience 
Manual and automatic bonding experience

Typical Education and Experience

Typically a High School Diploma and 1 year work experience or equivalent experience