Job Description

**Job Summary:

**

Perform a wide variety of assembly operations on RF and Microwave hybrid assemblies or subassemblies. Determine and/or follow methods and sequence of operations. Make setups, adjustments, and certifications of assembly equipment as required. Perform the various tasks necessary to assemble electronic assemblies for production.

**Job Responsibilities:

**

• Wire/Ribbon bonding sub-systems integrating electronic components from work Instructions and assembly drawings.
• Manipulation of items using a variety of tools while using a microscope.
• Maintain logs and paperwork and forms accurately.
• Self-monitoring of workmanship
• Understand and follow all safety requirements, as well as ISO Practices and Procedures
• Other duties as assigned.

**Required Qualifications:

**

• Knowledge and experience in the practice of gold wire and gold ribbon bonding.
• 3+ years of experience.
• Ability to recognize non-conformities.
• Ability to multi-task and work in a flexible and changing environment.
• Familiarity with industry standard ESD practices.

**Preferred Qualifications:

**

• Familiarity with other hybrid microelectronics assembly operations such as die component mount with epoxy or substrate attach techniques.
• Familiarity with automation, such as auto die/auto wire/auto ribbon bonding
• Problem solving skills.
• Enthusiastic, cooperative, and positive team-oriented behavior.
• Good written and oral communication skills.
• High School Diploma or equivalent.

"This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government."

Machines & technologies you'll use:

• Wire Bonding Machine (WestBond)