Job Description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the steadfast pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

We are looking for a Senior Member of Technical Staff (SMTS) in either our Dallas or Folsom Design Center. Are you passionate about system and architecture for next generation of high-performance memory that has wide-ranging applications and inspiring change in memory systems? In the HBM Design Engineering team at Micron, we deliver novel solutions to increase bandwidth, capacity and reduce latency across memory and storage solutions

You will be part of a highly multi-functional team of technical subject matter experts collaborating closely with a world-wide team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best in class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.

Responsibilities will include, but are not limited to:

• Collaborate with architecture team and external customers on new product specifications

• Pathfinding to explore new system level solutions for future HBM products and make recommendations after performing highly technical feasibility analyses

• Drive interface logic chip and memory architecture solutions

• Develop circuit designs for memory array, input buffer, output buffer, control logic, address decode, datapath, and internal test logic, power generators, PLL

• Contribute expert knowledge to advance innovative technical solutions

• Provide advice and counsel to senior management on significant technical issues

• Coordinate and lead the layout process, including placement and routing optimization

• Contribute to cross group communication to work towards standardization and group success

• Proactively solicit feedback from Standards, CAD, modeling, and verification groups to ensure the design quality

• Drive innovation into the future Memory generations within a dynamic work environment

Successful candidates for this position will have:

• Experience delivering highly technical solutions

• In depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, analog circuit design, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies

• Expertise in DRAM design, logic design, 3D DRAM design

• Good verbal and written communication skills with the ability to efficiently synthesize and convey complex technical concepts to other partners and leadership

• Proven track record of innovation and problem-solving in high-performance memory development

Required Experience

• MS or greater

• 15+ years of relevant Engineering or Design Engineering experience

Job title and level can scale depending on experience and qualifications

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.