Job Description

Position Summary

Role and Responsibilities

• Developing mass production process of micro LED display (Knowledge of adhesive material and transfer process for micro sized chips).
• Micro LED chip Interconnection Technology Development.
• Improvement process and enhancement production yield.
• Defect analysis and trouble shooting for production process for micro LED display.

Skills and Qualifications

General Requirements:

• University graduated with Electronics Engineering, Materials Sciences and Chemical Engineering.
• Good at logical thinking, problem-solving, collaboration, and communication skills
• Industriousness, result-oriented, high energy, self-motivated, and creative individual.
• Being able to use English for working.
• Junior Level and Freshers are welcome.

Technical Requirement:

• Strong knowledge of materials and process of microelectronics (Interconnection technology: ACF, Solder, Conductive Paste, Conductive Ink, etc.)
• Be familiar with using failure analysis tools such as SEM, FIB, EDX
• Good understanding of polymer characterization
• Knowledge and skills related to semiconductor/display materials and process (Epi., Sputter, Photo-patterning, Plating, …)

If you have below skill, Advantage:

• Knowledge, experience and analysis ability of bonding technology and LED chip
• Knowledge and skills related to Laser and Repair
• Characteristics management and analysis of organic optical materials (film, molding etc.)

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