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Hardware Engineer

Samsung Electronics

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Tech Park, HI
LOCATION

Job Description

As posted by the hiring company

Job Overview:

Position Summary

Role and Responsibilities

  • Developing mass production process of micro LED display (Knowledge of adhesive material and transfer process for micro sized chips).
  • Micro LED chip Interconnection Technology Development.
  • Improvement process and enhancement production yield.
  • Defect analysis and trouble shooting for production process for micro LED display.

Skills and Qualifications

General Requirements:

  • University graduated with Electronics Engineering, Materials Sciences and Chemical Engineering.
  • Good at logical thinking, problem-solving, collaboration, and communication skills
  • Industriousness, result-oriented, high energy, self-motivated, and creative individual.
  • Being able to use English for working.
  • Junior Level and Freshers are welcome.

Technical Requirement:

  • Strong knowledge of materials and process of microelectronics (Interconnection technology: ACF, Solder, Conductive Paste, Conductive Ink, etc.)
  • Be familiar with using failure analysis tools such as SEM, FIB, EDX
  • Good understanding of polymer characterization
  • Knowledge and skills related to semiconductor/display materials and process (Epi., Sputter, Photo-patterning, Plating, …)

If you have below skill, Advantage:

  • Knowledge, experience and analysis ability of bonding technology and LED chip
  • Knowledge and skills related to Laser and Repair
  • Characteristics management and analysis of organic optical materials (film, molding etc.)

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