Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$176,000.00 - $242,000.00

Location:

Austin,TX, Bangalore,IND

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

This role is based in Bangalore, India

Role Overview

We are seeking an experienced and dynamic Engineering Leader in Semiconductor Hardware Development to drive the design, development, and delivery of advanced process equipment. The ideal candidate will bring deep technical expertise in Electrochemical Plating (ECP) equipment and/or wet cleaning systems, along with proven leadership in scaling high-performance engineering teams.

Experience

Minimum 15+ years of experience in semiconductor equipment/hardware engineering
Strong track record of leading complex system design and development programs in high-volume manufacturing environments
Strong track record of delivering full tool platforms or critical modules into HVM (High Volume Manufacturing)
Experience leading multi-disciplinary engineering teams (mechanical, fluidics, process, electrical, controls)
Proven ability to build and manage high-performing, cross-functional engineering teams

Core Technical Expertise

Deep hands-on experience in vacuum system design (mandatory), including chamber architecture, gas delivery, pumping systems, and contamination control
Strong expertise in Electrochemical Plating (ECP) systems:
Design and optimization of plating chambers, fluid delivery systems, and current distribution architectures
Understanding of wafer-level deposition uniformity, defect control, and process integration
Experience with electrolyte chemistry management, filtration, and recirculation systems

Extensive experience in wet processing / wet cleaning equipment:

Design of single-wafer and batch cleaning systems, including chemical dispense, rinse/dry modules, and fluid handling systems
Knowledge of surface preparation, contamination removal, and defectivity reduction techniques
Familiarity with materials compatibility, corrosion control, and chemical safety considerations
Demonstrated ownership of module-level or full system design, including mechanical, fluidic, thermal, and process integration aspects
Strong problem-solving capability in highly complex, failure-sensitive environments, including root cause analysis and reliability engineering

System Engineering & Integration

Experience in end-to-end equipment design, from concept architecture to qualification and production release
Expertise in multi-physics system interactions (fluidics, electrochemistry, thermals, and vacuum environments)
Exposure to process-tool interactions, including yield improvement, defectivity control, and throughput optimization

Global Exposure

Experience working with North American semiconductor OEMs or technology organizations
Proven success in cross-regional collaboration, including onsite engagements and global program execution

Innovation & Thought Leadership

Strong technical credibility demonstrated through:
Patents in semiconductor equipment, ECP, or wet processing domains
Conference publications (e.g., SEMI, IEEE, ECS) or equivalent industry contributions
Ability to drive innovation in process equipment design, focusing on yield, reliability, and cost of ownership

Leadership & Communication

Excellent communication skills with the ability to:
Translate complex technical concepts to executive stakeholders
Drive alignment across global engineering, process, and manufacturing teams
Proven leadership in mentoring senior engineers and fostering technical depth within teams

Work Flexibility

Willingness to collaborate across North America time zones in a globally distributed development environment

This role is based in Bangalore - India

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.