Back
Job Description
As posted by the hiring company
Job Overview:
Job Description
Make an impact. Our teams design and build advanced electronics that protect those on the front lines—from detecting threats for F‑35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we deliver tomorrow’s technology today. We draw strength from our differences and innovate for the future. You can, too.Why BAE Systems
Our flexible work environment helps you do meaningful work without compromising your life outside of work. Our mission is simple and profound: We Protect Those Who Protect Us®. Join us.
About the role
BAE Systems is seeking a Deputy Director to lead microelectronics engineering and foundry operations for a high‑visibility portfolio. You will steer strategy, execution, and continuous improvement across design, fabrication, packaging, and production for programs totaling $100M+ annually.
What you’ll do:
- Lead & Grow a High-Performing Team: Direct and mentor a team of skilled engineers and manufacturing professionals operating our 6-inch (150mm) wafer fabrication facility. Focus on creating a safe, high-quality environment where innovation thrives.
- Drive Innovation from Design to Production: Lead the full lifecycle of microelectronics component development - from initial design and fabrication through packaging and into large-scale production for both development and deployed programs.
- Be a Strategic Partner: Collaborate closely with Business Area leadership, providing critical insights and ensuring projects stay on schedule, within budget, and meet stringent performance requirements.
- Chart the Course for Future Success: Develop and champion a sector-level microelectronics capability roadmap, leveraging both internal expertise and insights from external leaders in the field.
- Ensure Operational Excellence: Establish and maintain best-in-class operating policies and procedures, aligned with company standards and regulatory compliance.
- Manage & Optimize: Drive budget and resource planning, setting key performance indicators (KPIs) for financial performance, staffing, yield, quality, and delivery. Identify and implement improvements to optimize operations, reduce costs, and accelerate production timelines.
What you'll bring:
- Proven Leadership: A demonstrated track record of successfully operating and managing advanced semiconductor chip manufacturing facilities in a production environment.
- Technical Expertise: Deep understanding of advanced process technologies, particularly within GaAs/GaN fabrication.
- Strategic Thinking: Ability to synthesize complex information, develop forward-looking roadmaps, and translate strategy into actionable plans.
- Problem-Solving Skills: Ability to analyze complex challenges, develop creative solutions, and implement effective strategies.
- Strong Communication Skills: Ability to effectively communicate with both technical and non-technical audiences, including senior leadership.
- Results-Oriented: A proven ability to deliver results in a fast-paced, demanding environment.
- Growth Mindset: A commitment to continuous learning, embracing new technologies, and fostering a culture of innovation within the team.
About BAE Systems Electronic Systems
BAE Systems, Inc. is a defense, aerospace, and security company headquartered in Falls Church, Virginia, with more than 40,000 employees worldwide. We serve, supply, and protect those who protect us. As one of the most geographically diverse international defense companies, we deliver a full range of products and services spanning air, land, maritime, space, and cyber, including advanced electronics, intelligence solutions, and dedicated customer support.Our culture is performance-driven and values-led, built on curiosity, creativity, and collaboration. Purpose isn't a tagline here. It's what drives us. We're developing breakthrough technologies that defend national security and make a lasting impact on our communities and our planet. When you join BAE Systems, you're not just building a career. You're contributing to a mission that truly matters.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Required Skills and Education
- Bachelor’s degree in Electrical Engineering, Materials Science, Physics, or related field; 15+ years in microelectronics with 10+ years leading wafer fab and packaging operations.
- U.S. citizenship with eligibility to obtain a Secret security clearance.
- Proven experience leading large organizations of engineers, technicians, and program staff.
- Demonstrated success planning, managing, and executing complex projects.
- Exceptional communication, collaboration, and stakeholder management skills.
- Passion for mentoring mid‑ to late‑career team members; proven talent development results.
Preferred Skills and Education
- Director‑level leadership in microelectronics (commercial or defense), especially in III–V technologies (GaAs/GaN), RF/MMIC, advanced packaging, and high‑reliability manufacturing.
