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Advanced Packaging Process Development Engineer

Micron

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Boise, ID
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Job Description

As posted by the hiring company

Job Overview:

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Process Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die process (Post probe wafer and die development) to improve capability, productivity and cost of such processes. You will take ideas from conception, through process maturity and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve process related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include support of the manufacturing line and enablement of advanced automation and data collection techniques.

You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.

Responsibilities include, but not limited to:

  • Develop strategies to improve process maturity for n+1 and beyond nodes.
  • Develop process roadmaps for 5+ years in post probe wafer and die processing.
  • Developing wafer and assembly process to meet the physical and electrical requirements of Micron’s products.
  • Optimizing process to reduce cost, availability, and improve hardware and process capability.
  • Collaborating with equipment development teams to develop innovative new solutions.
  • Conducting root cause and failure mode analysis to understand the limitations of current process and drive APTD development projects with OEMs vendors for solutions.
  • Performing fundamental research to drive innovative solutions for next-generation products.
  • Support process transfer to production facilities (some domestic or international travel may be required).

Minimum Qualifications:

  • B.S/M.S. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
  • 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
  • Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure.
  • Strong analytical and creative problem-solving skills.
  • Ability to use extensive technical knowledge to guide strategic directions.
  • Ability to resolve complex issues through root-cause or model-based problem solving.
  • Proficiency in statistics, preferably in statistical process control.
  • Ability to work independently, with minimal direction, and a focus on meeting commitments.
  • Ability to multi-task and manage numerous projects simultaneously.

Preferred Qualifications:

  • Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions.
  • Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
  • Hands on experience with wafer / assembly tools and overlay systems.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.